Mola diamantata a legante metallico per la rettifica dei bordi di wafer di silicio e zaffiro

Mole diamantate con legante metallico e utensili
July 17, 2025
Video Description:
Discover the Metal Bond Diamond Grinding Wheel, designed for precision edge grinding on silicon and sapphire wafers. This wheel offers uniform sharpness, exceptional abrasion resistance, and is available in various grit sizes and models for both dry and wet grinding. Enhance your production output with our durable and low-maintenance solution.